| 型号/型号规格 | 分类 | 品牌 | 封装 | 批号 | 数量 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| K4W4G1646E-BC1A | 存储IC |
SAMSUNG/三星 |
BGA |
17+ |
2500 |
|||
| EMMC64G-M525 | KINGSTON/金士顿 |
BGA |
20+ |
6500 |
||||
| KMDD6001DM-B320 | 存储IC |
SAMSUNG/三星 |
BGA |
18+ |
446 |
|||
| SDIN9DW5-64G | 内存芯片 |
SANDISK/闪迪 |
BGA |
14+ |
492 |
|||
| SDINBDG4-32G | 存储IC |
SANDISK/闪迪 |
BGA |
18+ |
320 |
|||
| H5AN4G6NBJR-XNC | SKHYNIX/海力士 |
BGA |
17+ |
100 |
||||
| K4P2E304EQ-AGC2 | SAMSUNG/三星 |
BGA |
17+ |
1000 |
||||
| H9CCNNNBPTMLBR-NTM | 存储IC |
SKHYNIX/海力士 |
BGA |
13+ |
643 |
|||
| KE4BS3A5A | KINGSTON/金士顿 |
BGA |
1226+ |
1122 |
||||
| KLEDG8JE5M-E001 | SAMSUNG/三星 |
BGA |
14+ |
1000 |
||||
| TC58NVG2S0HTA00 | THSHIBA |
TSOP |
16+ |
99 |
||||
| MT41K128M16JT-107G:K | 内存芯片 |
MICRON/美光 |
BGA |
13+ |
330 |
|||
| BCM43242KFFBG | BROADCOM/博通 |
BGA |
15+ |
13000 |
||||
| K6X4016T3F-TF70 | 内存芯片 |
SAMSUNG/三星 |
TSOP |
06+ |
1100 |
|||
| CY62157DV30LL-55ZSXI | 其他IC |
CYPRESS/赛普拉斯 |
TSOP |
06+ |
116 |
|||
| H26M31002GPR | 内存芯片 |
SKHYNIX/海力士 |
BGA |
14+ |
2200 |
|||
| MTFC8GLUEA-AIT | 内存芯片 |
MICRON/美光 |
BGA |
14+ |
168 |
|||
| KE4BT5D6A | KINGSTON/金士顿 |
BGA |
1244+ |
300 |
||||
| KLM4G1FEAB-B001 | 存储IC |
SAMSUNG/三星 |
BGA |
14+ |
690 |
|||
| H9TP33A8LDMCMR-KYM | 内存芯片 |
SKHYNIX/海力士 |
BGA |
13+ |
1930 |
|||
| H9DPAGA3JJMCGR | 内存芯片 |
SKHYNIX/海力士 |
BGA |
13+ |
950 |
|||
| THGBM5G7B2JBAIM | 存储IC |
TOSHIBA/东芝 |
BGA |
13+ |
699 |
|||
| SDIN5C1-32G | SANDISK/闪迪 |
BGA |
12+ |
990 |
||||
| THGBM3G5D1FBAIE | THSHIBA |
BGA |
13+ |
300 |
||||
| K9F2G08U0C-BIB0 | 存储IC |
SAMSUNG/三星 |
BGA |
12+ |
2746 |
|||
| MT29MZZZ4D1QJFKP-25I | MICRON/美光 |
BGA |
13+ |
1200 |
||||
| KLMCG8GE2A-A001 | SAMSUNG/三星 |
BGA |
12+ |
80 |
||||
| THGBM1G4D1EBAI7 | THSHIBA |
BGA |
10+ |
450 |
||||
| H26M42001EFRe-NAND | SKHYNIX/海力士 |
BGA |
10+ |
500 |
||||
| H5PS5162FFR-S6C | 其他被动元件 |
SKHYNIX/海力士 |
BGA |
10+ |
2000 |